• Heating transfer by optimized full covection
• Hightest process stability by monitoring sensors and sensor technology
• The slightest difference of temperature on the PCB and therefore low stress level, especially for critical components as diodes
• Optimized air guiding in the system and on the product results in low energy consumption
• Easy maintenance concept

In SMT reflow systems the heat tranfer takes place by full convection. Heated process gas (air, nitrogen) is guided on the products by nozzle plates. The resulting temperature profile has to be conform with guidelines of component and solder paste manufacturer.